Slipping Layer for Thermal Donor

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Abstract:

Resistive-head thermal dye transfer printing is a digital printing method in which thermal energy is used to create photographic quality output by the transfer of dyes from a donor ribbon to a receiver that are in intimate contact. Dye donor elements consist of support, dye layers, adhesive layers, laminate overcoat layers, and slipping or heat-resistant layers. Slipping (or slip) layers are coated on the opposite side from the dyes on the thermal donor. The primary function of the slipping layer is to facilitate transport of the donor under the thermal printhead. These layers have several characteristics, including the ability to provide low and constant friction over the entire printing temperature range, to be noncontaminating and nonabrasive to the printhead, and noninteractive with the other layers when spooled. Slipping layers typically contain lubricants, polymeric binders, solvents, and other addenda to achieve photographic quality printing. Work over the past few years has focused on the redesign of the slipping layer for enhanced performance features. The result is a layer that provides enhanced lubrication, improved retransfer protection from the dye side to the slip side upon spooling, improved fold performance in the printing operation, and cleaner printheads during printing.

Document Type: Research Article

Publication date: January 1, 2007

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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