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Thermal analysis technology of full color thermal printing

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We examined simulation of full color thermal printing.

In NIP22, we reported thermal head design by automatic iterative calculation of two-dimensional heat conduction analysis. We developed the thermal head with small variation and low power consumptions by applying Taguchi Method to the parameter optimization.

This time, by enhancing an analytical model to three dimensions, we became possible the simulation of the temperature distribution not only in direction of paper transportation and depth but also in in-plane each layer. As a result, the relation between the structure of thermal head and the internal temperature distribution of paper was clarified. We examined the thermal head structure that is appropriate for thermal print by using this analytical model.
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Document Type: Research Article

Publication date: 2007-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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