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Thermal analysis technology of full color thermal printing

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We examined simulation of full color thermal printing.

In NIP22, we reported thermal head design by automatic iterative calculation of two-dimensional heat conduction analysis. We developed the thermal head with small variation and low power consumptions by applying Taguchi Method to the parameter optimization.

This time, by enhancing an analytical model to three dimensions, we became possible the simulation of the temperature distribution not only in direction of paper transportation and depth but also in in-plane each layer. As a result, the relation between the structure of thermal head and the internal temperature distribution of paper was clarified. We examined the thermal head structure that is appropriate for thermal print by using this analytical model.

Document Type: Research Article

Publication date: January 1, 2007

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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