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Digital Printing of Optical Components

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The use of direct write micro-printing for opto-electronic packaging is being accepted as a key enabling technology, specifically printing microlenses for optical interconnects and solders for electrical interconnects. This paper presents these two areas where micro-printing technology benefits opto-electronic packaging. For increasing light coupling efficiency, a microlens array is actively aligned and attached to a VCSEL array and photodiode array in smart pixel technology. A microlens array is also directly integrated with a VCSEL array in a wafer level fabrication. Solder jet is used for either bumping the VCSEL die or for directly connecting the VCSEL die with circuits on a substrate. By using micro-printing, components can have less part-count and smaller package size. The labor required for conventional optical alignment can be greatly reduced. Thus this technical advancement offers also cost effectiveness in manufacturing.

Document Type: Research Article

Publication date: January 1, 2006

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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