Green Ink-Jet Technology for Fabrication of Multilayer Flexible Circuit Part II: Reliability Testing
Abstract:The requirement of green technology is urgent for printed circuit boards (PCB). Not later to 2006, all the electronic products need meet green environment policy in Europe. In this paper, a novel and simple process to manufacture multilayer PCB was proposed. Follow our prior researches, base on the process of combining the self-assembly polyelectrolyte (SAP), ink-jet printing of catalyst, and electroless plating to form metal circuit pattern on the flexible substrate. This paper extended its application to fabricating of multi-layer flexible substrate. A double-sided flexible substrate with insulating material and connection holes was accomplished by this new improvement. By testing of IPC 6013 standard, the aspect ratio of thickness for metal foil and metal forming in hole was ideally near to one. In the impedance examination, the actual data was considerably closed to ideal data, within a variation of 0.4%. This improvement is helpful to fabricate high performance metal circuit on multilayer flexible substrate with holes.
Document Type: Research Article
Publication date: 2006-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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