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Green Ink-Jet Technology for Fabrication of Multilayer Flexible Circuit Part I: System Construction & Fabrication Process

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Printed circuit boards (PCB) are being widely applied for related electronic produces in industry. The trend in the future is toward narrower metal line, tiny via hole, and complex multilayer manufacture processed. The challenge is therefore for the difficulty of producing excellent metal thickness on substrate surface and inner surrounding of holes for high level application. This study proposed an improving method on electroless plating, and combined with the ink-jet printing of catalyst to form a high aspect ratio of metal thickness for the substrate surface and hole inner wall. This study laminated the flow direction by dynamic pressure control and modulated the velocity at divergence along the substrate surface and hole inner wall. Meanwhile, the stabilization of electroless plating was tuned by an inner flow circulation, to reduce of cavity defect in metal forming. By this system improving, high performance circuit at full reliability was made on multilayer flexible substrate with holes, the variation of aspect ratio of thickness can control within 13%, and further reduce up to 2% with the hole diameter decrease.
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Document Type: Research Article

Publication date: 2006-01-01

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  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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