Skip to main content

Variable Droplet Size Molten Solder Ejection Tool for Microelectronics Packaging

Buy Article:

$12.00 plus tax (Refund Policy)

A unique piezo-drive diaphragm type head, which enables molten solder droplets to be ejected over a wide range of diameters, has been developed in order to apply the solder droplet deposition method for various applications in microelectronics packaging. The features of this method are a mask-less process and lead-free soldering without soldering flux, therefore a flexible and eco-friendly operation can be realized in contrast to conventional plating or screen-printing methods. The prototype head can continuously adjust the droplet diameter from 35 μm to 200 μm.

In this paper, a simple analytical model of the droplet formation process is proposed and an empirical formula, which estimates the droplet diameter affected by the nozzle diameter and the piezo-drive period, is derived from the experimental investigation. It is also confirmed that the estimated values agree with the results by Flow-3D fluid dynamics simulation software.

Using the prototype head and formula, it becomes easier to adjust the droplet size suitable for each application. We also show application examples such as a solder sealed vacuum package fabricated with the droplet diameter of 200 μm, and a solder filled through-hole with one of 40 μm.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Article Media
No Metrics

Document Type: Research Article

Publication date: 01 January 2006

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

  • Information for Authors
  • Submit a Paper
  • Subscribe to this Title
  • Membership Information
  • Terms & Conditions
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more