Variable Droplet Size Molten Solder Ejection Tool for Microelectronics Packaging
In this paper, a simple analytical model of the droplet formation process is proposed and an empirical formula, which estimates the droplet diameter affected by the nozzle diameter and the piezo-drive period, is derived from the experimental investigation. It is also confirmed that the estimated values agree with the results by Flow-3D fluid dynamics simulation software.
Using the prototype head and formula, it becomes easier to adjust the droplet size suitable for each application. We also show application examples such as a solder sealed vacuum package fabricated with the droplet diameter of 200 μm, and a solder filled through-hole with one of 40 μm.
Document Type: Research Article
Publication date: 01 January 2006
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