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Polymeric Film Technology for the Jettable Fluid Delivery Assembly and Harsh Environment Protection

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Abstract:

Jettable fluid delivery and other microelectro mechanical (MEM) devices are becoming smaller in addition to being exposed to more extreme environments. These devices or packages rely on polymeric materials as structural adhesives for the assembly of various substrates. These polymer materials also provide protection from mechanical shock, extreme thermal cycles, and can withstand long exposure to the harsh chemical environment of the jetting fluids. Because these devices are becoming smaller, it is more difficult to accurately apply the structural adhesives. This poster will discuss an alternative adhesive format which is a very precise thickness film. These films are versatile and are designed with many physical and property options such as: supported or unsupported, thermally and/or electrically conductive, dielectric, low temperature attach and low voiding. In addition, the paper will describe the various film formats, film attach techniques and the part assembly processes.

Document Type: Research Article

Publication date: January 1, 2006

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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