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Ink Jet Printed Metals and Conducting Polymers

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Ag, Cu and Ni metallizations were inkjet printed with near vacuum deposition quality. The approach developed can easily be extended to other conductors such as Pd, Pt, Au, etc. Thick, highly conducting lines of Ag and Cu demonstrating good adhesion to glass, Si and printed circuit board (PCB) have been printed at 100-200°C in air and N2 respectively. Ag grids were inkjet-printed on Si solar cells and fired through the silicon nitride antireflection (AR) layer at 850°C resulting in solar cells with 8% efficiency. Next-generation multicomponent inks (including etching agents) have also been developed which demonstrate improved fire-through contacts, leading to higher cell efficiencies. Poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate PEDOTPSS polymer based conductors were inkjet printed with conductivity as good or better than that of spin-coated films.

Document Type: Research Article

Publication date: January 1, 2005

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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