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Ink Jet Printed Metals and Conducting Polymers

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Ag, Cu and Ni metallizations were inkjet printed with near vacuum deposition quality. The approach developed can easily be extended to other conductors such as Pd, Pt, Au, etc. Thick, highly conducting lines of Ag and Cu demonstrating good adhesion to glass, Si and printed circuit board (PCB) have been printed at 100-200°C in air and N2 respectively. Ag grids were inkjet-printed on Si solar cells and fired through the silicon nitride antireflection (AR) layer at 850°C resulting in solar cells with 8% efficiency. Next-generation multicomponent inks (including etching agents) have also been developed which demonstrate improved fire-through contacts, leading to higher cell efficiencies. Poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate PEDOTPSS polymer based conductors were inkjet printed with conductivity as good or better than that of spin-coated films.
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Document Type: Research Article

Publication date: 2005-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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