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Thermal Ink Jet Printing of Electronic Materials and Devices

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Hewlett-Packard has recently demonstrated that thermal inkjet (TIJ) can be used to print a large variety of materials including organic solvent based systems, colloidal dispersions of nanoparticles, inorganic precursor solutions, polymer light emitting materials, color filters, and adhesives. This paper will discuss the integration of TIJ printed electronic materials (conductors, semiconductors, and dielectrics) to form thin-film transistors (TFTs). We have obtained field-effect mobilities of 3 to 4 cm2V−1s−1 for TFTs with TIJed semiconductor (channel), with on-to-off ratios of 106 - 107. TIJ-deposited gate dielectrics have shown a gate dielectric breakdown field >1 MV/cm, with maximum gate current leakage ∼2-5 nA/cm2.

Document Type: Research Article

Publication date: January 1, 2005

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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