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Thermal Ink Jet Printing of Electronic Materials and Devices

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Hewlett-Packard has recently demonstrated that thermal inkjet (TIJ) can be used to print a large variety of materials including organic solvent based systems, colloidal dispersions of nanoparticles, inorganic precursor solutions, polymer light emitting materials, color filters, and adhesives. This paper will discuss the integration of TIJ printed electronic materials (conductors, semiconductors, and dielectrics) to form thin-film transistors (TFTs). We have obtained field-effect mobilities of 3 to 4 cm2V−1s−1 for TFTs with TIJed semiconductor (channel), with on-to-off ratios of 106 - 107. TIJ-deposited gate dielectrics have shown a gate dielectric breakdown field >1 MV/cm, with maximum gate current leakage ∼2-5 nA/cm2.
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Document Type: Research Article

Publication date: 2005-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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