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Fabrication of Electrical Circuit Using Palladium Colloid

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A precise electrically conductive circuit was fabricated on a plastic film substrate with an electroless Cu-plating layer that was formed on a metal colloid printed pattern. The printed pattern was formed with the inks that contain the mixture of silver colloid and palladium colloid. The degree of catalytic activity of the printed pattern upon the electroless Cu-plating was enhanced by the addition of an extremely small amount of palladium colloid into the metal colloid ink; plating speed was increased by the three times on the metal colloid pattern that was formed with the inks containing only 1 wt% of mixed metal colloids. The Electronic circuit formation and its practical performance were confirmed for the circuit fabricated by both PIJ (Cu-plating on ink jet pattern) and PFS (Cu-plating on filled and squeezed pattern) processes.

Document Type: Research Article

Publication date: January 1, 2005

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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