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Continuous Roll-to-Roll Circuit Fabrication by Ink Jet Printing Process

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Flexible substrates are becoming more important in the printed circuit board industry. The flexible circuit boards can be thinner and lighter than rigid board, and can be flexibly and easily assembled into high level electronic product. In this paper, we developed the ink jet printing technique to form the copper metal wire on flexible substrate. It combines the self-assembled polyelectrolyte as surface treatment, the ink jet printing of catalyst, and electroless plating processes into one continuous roll-to-roll system. Specially, the working surface of the substrate is kept out of contact with each transmitting roller to avoid the pollution in this continuous roll-to-roll circuit fabrication system by ink-jet printing. This design is important for modular process flow. To avoid the elongation and alignment deviation of flexible substrate, this continuous roll-to-roll system also has a robust tension control to guarantee the position accuracy of about ±10μm. In this study, all the process flow are tabulated and discussed, especially in the arbitration between the ink-jet patterning step and other processes.

Document Type: Research Article

Publication date: 2005-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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