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Ink-Jet Printed Passive Electronic Components: Metal-Insulator-Metal Device

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Abstract:

In this study, an ink-jet printed poly(methylmethacrylate)(PMMA) solution with mixed organic solvent to form insulator was presented. A detail observation of ring edge behavior for Ink-Jet Printing (IJP) device and its process parameters relation had been evaluated. One of the layer structure consisted of a thin layer of adhesive polymer (polyvinyl acetate: PVA) between bottom electrode and printed insulator layer, and then to treat the spincoated thin PVA with CF4-plasma to raise the contact angle up to 40∼50 degrees. Besides, a mixed solvent comprised of one solvent having lower boiling point and another one having higher boiling point was used to improve the ring-effect as well. Heating the platform as the droplet is landing also mitigates the effect of coffee-ring. Single-layer insulator device is very easy to be leakage, so triple-layered insulator device is made and then has better capacitance characteristic. Experimental results indicated that the leakage current for ink-jet fabricated multi-layered insulator was about 10nA/cm2 at 3V, and the dielectric constant for the printed insulator was about 3.0.

Document Type: Research Article

Publication date: January 1, 2005

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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