Skip to main content

Nanoscale Patterning of Organic and Metallic Features on Semiconductors via Self-Assembly of Soft Materials

Buy Article:

$12.00 plus tax (Refund Policy)

Nanostructured materials continue to be the focus of intense research due to their promise of innumerable practical applications as well as advancing the fundamental understanding of these intriguing materials. In particular, the need for metallic and organic features of increasingly smaller size regimes has imposed stringent demands upon chemists to produce a variety of highly functional materials with reduced dimensions. The successful realization of arrayed nanosensor and nanoelectrode production, molecular electronics, ultra large scale integration (ULSI) device fabrication, and nanoelectromechanical systems (NEMS) will require unparalleled precision and control of geometry, aspect ratio, surface morphology, deposition rate, and substrate adhesion without sacrificing throughput or cost effectiveness. While much effort has been expended towards the synthesis of nanoscale structures, one of the most challenging aspects for the nanoscale materials community is the question of how to ‘wire in’ these functional elements with the real world. In this talk, we will describe recent work towards the interfacing of nanoscale patterns of organic molecular and metallic structures with semiconductor surfaces such as silicon, germanium, gallium arsenide and indium phosphide. We have developed a repertoire of chemical reactivities on semiconductor interfaces, and are now patterning them through straightforward and efficient, highly parallel patterning strategies via self-assembly of soft polymer materials. The self-assembled materials direct transport of reagents to the semiconductor so that the reaction takes place in a spatially defined manner, with precise control over the quantity of reagent delivered. Even mixtures of reagents can be ‘sorted out’ by these interfaces to produce nanoscale (∼10 nm) domains of different chemical functionalities, simultaneously. We will describe these and related approaches towards precise patterning of semiconductor surfaces, entirely via wet-chemical processes that are compatible with existing fabrication strategies.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Data/Media
No Metrics

Document Type: Research Article

Publication date: 2005-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

  • Information for Authors
  • Submit a Paper
  • Subscribe to this Title
  • Membership Information
  • Terms & Conditions
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more