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Direct Deposition of Electronic Materials with Thermal DPN

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In recent years there has been a significant effort to improve or augment lithographic techniques for electronic device fabrication. Although improvements in ultimate resolution have been a central goal, other goals have also been pursued that may be important avenues to advance device fabrication. These alternate objectives include reduction of toxic by-products (“green chemistry”), integration of disparate materials into a single structure (e.g., organic and inorganic), and production or prototyping of low numbers of integrated circuits at relatively low unit cost. Progress towards all these goals is found in a new lithographic technique, thermal Dip Pen Nanolithography (tDPN). In tDPN (Figure 1), an atomic force microscope (AFM) cantilever is custom fabricated to include a heater directly above the tip. The tip is then coated with an “ink” that is solid at room temperature but that can be melted by the integrated heater. When the ink is melted, it flows onto the surface and solidifies, thereby allowing arbitrary patterns to be written.

Document Type: Research Article

Publication date: 2005-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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