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Novel Concepts in Direct Writing of Electronics and Sensors

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This paper outlines new capabilities in the arena of maskless direct writing of advanced materials for applications in thick film electronic circuits and sensors. The genesis of this capability lies in advanced concepts based on a thermal spray particle-based deposition technology which allows for printing of 3D conformal mesoscale components of metals, ceramics, composites and polymers onto a range of substrates at low substrate temperatures. The capabilities derived offer new approaches towards integrating structures with electronics and sensors.
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Document Type: Research Article

Publication date: 2005-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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