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Novel Concepts in Direct Writing of Electronics and Sensors

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Abstract:

This paper outlines new capabilities in the arena of maskless direct writing of advanced materials for applications in thick film electronic circuits and sensors. The genesis of this capability lies in advanced concepts based on a thermal spray particle-based deposition technology which allows for printing of 3D conformal mesoscale components of metals, ceramics, composites and polymers onto a range of substrates at low substrate temperatures. The capabilities derived offer new approaches towards integrating structures with electronics and sensors.

Document Type: Research Article

Publication date: January 1, 2005

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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