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Novel Silicone Sycar® Hybrid Adhesives for Harsh Fluid Resistance

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Abstract:

Sycar®-silicone hybrid materials are explored for applications where resistance to harsh environments, immersion in or contact with printing inks and other harsh fluids, is required. The primary application for such products is circuit assembly and protection materials for microelectronic devices such as ink jet printheads. The Sycar®-silicone hybrid technology has been proven effective for circuit protection in MEMS devices where increased reliability in harsh operating environments is required. Platform work showed that Sycar® can be crosslinked with vinyl polydimethylsiloxane through platinum catalyzed hydrosilylation chemistry. The resulting materials are flexible, in a wide range of moduli and adhere well to silicon, metals and engineering substrates. Furthermore, properties are retained when the materials are immersed in corrosive fluids such as inks. These hybrids have an advantage over conventionally crosslinked silicones, which have limited chemical resistance. It has been demonstrated that silicones can be used in small quantities to toughen fully crosslinked Sycar®, which is otherwise brittle. These hybrids are approaching epoxies for mechanical properties but maintain many desirable properties of silicones. From this platform work, three product types have been identified, based on Sycar®-polysiloxane. They are: hybrid gels, tough rigid elastomers, and high hardness, abrasion resistant materials which are unique to the silicone product family.

Document Type: Research Article

Publication date: 2005-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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