Development of a Cross-Linked Imaging Layer for Thermal Dye Transfer Receiver
Abstract:A thermal dye transfer receiver, which comprises a three-dimensionally cross-linked dye-receiving(imaging)layer, has been developed. The dye-receiving layer is a polyurethane coating employing aliphatic polyisocyanates, bisphenol A-containing polyols, and a tin catalyst.
The major technical challenges during technology development were: (a) to develop and employ new materials and chemistry in achieving desirable image quality and physical performance, (b) to enable cross-linking reaction to completion during the formation of the dye-receiving layer, i.e., no post-curing was required, and (c) to modulate and optimize the degree of cross-linking in the dye-receiving layer in such a manner as to enhance the physical performance of the receiver without hampering the dye-transfer efficiency, which is due to a rather restricted three-dimensional network.
The advantages of the developed cross-linked dye-receiving layer comprise: (1) superior photographic sensitometry, color balance, and customer-preferred neutral tone; (2) excellent release between dye donor and receiver during thermal printing; (3) a simpler dye-receiving layer structure; (4) very good light fastness; and (5) the elimination of the use of chlorinated coating solvent previously used for making the dye-receiving layer.
Document Type: Research Article
Publication date: 2004-01-01
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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