A Novel Etching Method of Silicon Nozzle Plate Manufacture for Monolithic Inkjet Print Head

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The aim of this work is to develop a novel silicon etching method in the manufacturing of a silicon nozzle plate for a monolithic inkjet print head. The nozzle plate was etched by inductively coupled plasma (ICP) etching for orifice definition and wet etching for bulk surface definition. Depth of the wet etching process for thickness deviation of nozzle plate is less than 4 μm and the surface roughness is less than 40 Å. After the deep wet etching step with etching depth around 370μm and the ICP dry etching process, electrical characteristics of the driver circuits still work normally. The etching methods on silicon nozzle plate manufacture for monolithic inkjet print head in this study provide a better surface roughness of outlet surface of nozzle plate and keep the good thickness uniformity of nozzle plate.

Document Type: Research Article

Publication date: January 1, 2004

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  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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