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A Novel Etching Method of Silicon Nozzle Plate Manufacture for Monolithic Inkjet Print Head

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The aim of this work is to develop a novel silicon etching method in the manufacturing of a silicon nozzle plate for a monolithic inkjet print head. The nozzle plate was etched by inductively coupled plasma (ICP) etching for orifice definition and wet etching for bulk surface definition. Depth of the wet etching process for thickness deviation of nozzle plate is less than 4 μm and the surface roughness is less than 40 Å. After the deep wet etching step with etching depth around 370μm and the ICP dry etching process, electrical characteristics of the driver circuits still work normally. The etching methods on silicon nozzle plate manufacture for monolithic inkjet print head in this study provide a better surface roughness of outlet surface of nozzle plate and keep the good thickness uniformity of nozzle plate.
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Document Type: Research Article

Publication date: 2004-01-01

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  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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