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Thickness Influence on the Single Layer Organic Photoreceptor Properties

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Abstract:

The principle electrostatic parameters and the continuous performance of single-layer organic photoreceptors (SL OPR) in imaging cycle mode, such as in repeated usage in digital laser printers, are strongly dependent on the thickness of the photoreceptor. In addition to the electrostatic parameters, the charging conditions and the inertness of the photo-discharge are important during cycling. The role of OPR thickness was investigated for SL OPR containing TiOPc charge generation material, poly(vinyl butyral) binder, hydrazone based hole transport material and an electron transport material. The dependence of the charge-voltage characteristic, maximum achievable charging acceptance, photosensitivity, potential dark decay, and residual potential on SL OPR thickness was determined for positive and negative biased OPR via a novel dosed charging diagnostic method. The influence of SL OPR thickness on the discharge potentials, as evaluated 50 ms and 300 ms after a short light pulse, and on the residual potential was determined in cycling mode. The observed regularities were explained by characteristics of light absorption, charge carrier generation, and carrier drift and trapping within the SL OPR.

Document Type: Research Article

Publication date: 2004-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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