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Novel Hydrazone and Azine Based Hole Transport Materials

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Abstract:

Thirteen novel hole transport materials were prepared in our labs either as polymeric structures (Compounds (1) – (7)) or as dimeric structures (Compounds (8)-(13)) and several were evaluated for electrophotography. These hole transport materials contain either hydrazone or azine moieties as part of the electrophotographically functional chromophore. The chemical structure of these compounds was confirmed by proton NMR, infrared and ultraviolet spectroscopy. The ionization potential and hole mobility (determined via a xerographic time of flight method) are reported for some of these compounds. The presence of hydroxyl groups on some of these materials improves adhesion and compatibility with traditional polycarbonate (PC) and polyvinylbutyral (PVB) binder materials. In addition, these dimeric or polymeric hole TM can be chemically cross-linked in the photoconductive layer, for example, by reaction of the hydroxyl groups with polyisocyanates, to increase the layer stability to bending, stretching and abrasion, as well as the effects of abrasion. The synthesized TM and compositions with binder exhibit good hole transporting properties and high mobility making them useful for preparation of high sensitivity electro-photographic photoconductors.

Document Type: Research Article

Publication date: January 1, 2004

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  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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