Application of Printable Electronics for LCD Manufacturing: Printing of TFT Gate Layers and Pillar Spacers
In this paper we present results of ink jet printing gate metal lines of thin-film transistors (TFTs) on a liquid crystal display's (LCD) active plate. The major components of this study are 1) the formulation of metal precursor inks that have good electrical properties, 2) the printing and layer formation of the materials, and 3) the manufacturing and characterisation of TFT arrays with a printed gate and storage capacitor lines. In addition, we show results on printed spacers for LCDs.
We demonstrate printed gate lines (50 μm wide and 250 nm thick) with a resistivity of around 3 μΩ·cm, cured at 350 °C. During layer formation, Rayleigh-type instabilities were prevented and favourable layer thickness profiles have been obtained by tuning the printing frequency, evaporation rate of the solvent, and type of metal colloids. Fabricated TFTs have similar characteristics as those obtained with conventional methods and materials (on-off ratio > 106 and a mobility around 0.5 cm2/Vs).
Document Type: Research Article
Publication date: 01 January 2004
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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