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Materials and Processes for High Speed Printing for Electronic Components

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Printing methods already familiar to the graphic arts industry can be used to apply carefully designed electronic materials at high speed and low cost. Processes such as offset lithography, gravure, flexography and inkjet are being used to manufacture electronic components. Each method has advantages and disadvantages in terms of process capabilities, and differences in material properties required to run. For both historical and pragmatic reasons, the patterning and layering capability of high-speed printing has been limited to suit the resolving power of the human eye. Experiments have been conducted to benchmark existing capability of these processes and materials on flexible substrates. Such experiments will provide a foundation for exploring the viability of existing printing infrastructure for the mass production of commercial products. In addition, improvements in these electronic materials and the mechanics of printing processes may provide significant advancement of future application capability.

Document Type: Research Article

Publication date: 2004-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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