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Production of Microelectronic Components by Electrophoretic Deposition

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Electrophoretic deposition (EPD) is a particle based, electrodynamic forming process suitable for particles in the micron to nanometer size range. Beginning with a 300 nm diameter silver/palladium powder we have used EPD to produce 5 μm wide conductor lines with a 10 μm spacing on a dielectric tape.

In this process a component is first imaged as a conductive pattern on a plastic film by conventional photolithography. This pattern is then immersed into a stable, dispersed and electrostatically charged suspension of particles. A voltage is applied between the conductive pattern and a counter electrode in the suspension, causing a current flow through the suspension, and attracting particles to the conductive pattern. The current creates an electro-chemical environment at the surface which causes the particles to deposit onto the pattern. This deposition can range from a monolayer to many thousands of particles thick. Using a binder, these deposited particles can then be transferred to another surface to be sintered or fused forming continuous lines or layers. The photolithographically produced conductor pattern can be re-used repeatedly to create more depositions. In this manner a single pattern produced by photolithography can be used to make multiple parts with photolithographic scale resolution.

Document Type: Research Article

Publication date: 2004-01-01

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  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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