Skip to main content

A Study of Electrophotography Process for Manufacturing Printed Circuit Board

Buy Article:

$12.00 plus tax (Refund Policy)

Cost down of printed circuit boards (PCB) is one of critical issue for electronic components and semiconductor packages. A new wiring process using electrophotography technology is reported in this paper. The new process provides mask-less manufacturing and cost down capability for PCB. Cu wiring patterns can be formed by printing toner including metal fine particles and electroless plating in which metal particles work as catalyst. Insulating layer is also available in the same way by resin toner without metal particles. Repetition of patterning of insulating layer and wiring layer builds up multi-layer structure of PCB.

The optimization of electrostatic charge of toner including metal particles and quality of electroless plating on patterned layer is needed. Therefore, relationships between charge of toner, electroless plating ability and contents of metal particles are clarified. Furthermore, forming insulating layer and multi-layer structure is investigated. Using samples made by the new technology, some basic reliability evaluations for PCB and soldering demonstrations are also carried out.

Electrophotography process with electroless plating is confirmed to have a good ability for mask-less PCB manufacturing in electronic component applications.
No Reference information available - sign in for access.
No Citation information available - sign in for access.
No Supplementary Data.
No Article Media
No Metrics

Document Type: Research Article

Publication date: 2004-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

  • Information for Authors
  • Submit a Paper
  • Subscribe to this Title
  • Membership Information
  • Terms & Conditions
  • Ingenta Connect is not responsible for the content or availability of external websites
  • Access Key
  • Free content
  • Partial Free content
  • New content
  • Open access content
  • Partial Open access content
  • Subscribed content
  • Partial Subscribed content
  • Free trial content
Cookie Policy
X
Cookie Policy
Ingenta Connect website makes use of cookies so as to keep track of data that you have filled in. I am Happy with this Find out more