Electrophorectic Self Assembly, A Manufacturing Process for Various Industries
A typical use for this technology is the high volume manufacture of RFID(radio frequency identification tags). Silicon die of the order 400x400x50 micron in dimension needs to be accurately placed in X & Y; rotated in alignment with the x axis, and oriented (heads vs tails) or correct side up. For commercial success this needs to be done quickly and at cost levels approaching the graphic art industry. I will describe experiments in which silicon die is coated (one side) with a charge control layer, which when dispersed in an Isopar diluent (containing a suitable charge director); will impart are suitable ionic charge to the die. This will allow it to be placed, rotated and oriented on a suitable substrate.
The presentation will report progress in this endeavors and include calculations of the expected imaging forces and a limit to the largest die than can be imaged. Other possible commercial applications will be discussed.
Document Type: Research Article
Publication date: 2004-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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