Study of Thermal Print Head for High-Speed Print
Abstract:We studied a thermal print head featured high-speed print. In the former paper, we reported renovated head design and structure of a thin layer showing low thermal diffusivity formed on a substrate with high thermal diffusivity to attain 1200dpi high definition print. And we have developed such print head consisted of single crystal silicon substrate and sputtered film. We also conducted FEM analysis to the newly developed print head to evaluate the possibility of high speed print. As a result, we came to a conclusion that 40IPS (inch per second) using 300dpi head was technically achievable and print test using 600dpi head proved reliable print quality.
Document Type: Research Article
Publication date: 2003-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
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