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Conductive Toner Cloud Confinement Using the Cone Shape of Dented Electrode

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Control of toner movement is an important parameter in the development of digital printing, which uses toner. The conductive toner has possibilities of new, simple printing mechanism. The conductive toner particles were sprayed onto the lower electrode. An electric field was applied between the two electrodes. The toner moved up and down between the two electrodes by electrostatic force. When the cone shape of the dented electrode replaced the lower plate, conductive toner particles were confined in the dented electrode. This research studied the toner confinement conditions required to form a toner cloud state using the cone shaped dented electrode. We found that the depth of cone-shaped, dented lower electrode, the resistivity of conductive toner and applied voltage between the electrodes are the influencing factors that determine the optimum size of toner cloud confinement and the toner jumping current. The deeper cone shaped, dented electrode reduces the size of the toner cloud confinement and the required toner jumping current. A high resistivity toner produces a larger size toner cloud and decreases the toner jumping current. When a greater amount of toner is placed into the electrode, a larger size toner cloud and greater toner jumping current are obtained. A higher applied voltage reduces the size of the toner cloud and increases the toner jumping current.

Document Type: Research Article

Publication date: January 1, 2003

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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