Polymeric Material Solutions for Jetable Fluid Delivery Assembly and Harsh Environment Protection
Abstract:Jetable fluid delivery and other MEMS devices are being exposed to more extreme environments. These packages rely on polymeric materials as structural adhesives for various substrates. The materials also provide protection from mechanical shock; extreme thermal cycles, and can withstand long exposure to harsh chemical environments. This paper will discuss the advantages and limitations of thermoset polymeric solutions, their properties as well as the necessary selection criteria to maximize adhesion and environmental resistance. In addition, the choice of lab test methods and test design conditions are critical in the optimization, reliability and performance of the products used in the application.
Document Type: Research Article
Publication date: January 1, 2002
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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