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UV Curable Ink Jet Raw Material Challenges

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Radiation curable ink jet printing is rapidly developing new technology for digital imaging. The strict property requirements of an ink jet ink formulation in terms of viscosity, cure speed, cured film performance, pigment wetting and friendly EH&S profile present many challenges to the ink formulator and the supplier of radiation curable raw materials. Traditionally radiation cured inks and coatings have used relatively high molecular weight/high viscosity oligomers to acheive properties. The presentation will cover properties and performance aspects of monomers and oligomers suitable for radiation curable ink jet systems. A main focus will be on a new family of low-viscosity/high functionality polyester acrylates that address many of the performance issues noted above.

Document Type: Research Article

Publication date: 2002-01-01

More about this publication?
  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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