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Study of 1200dpi High Resolution Thermal Print Head

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This paper is intended as an evaluation of a high-resolution thermal print head exceeding 600dpi. In the preceding paper we reported on the optimum structure and shape for 600dpi-head based on a series of experiments on thermal diffusivity of various materials possibly used as components. In the process of development we reached a two-ply structure consisted of a Si-single-crystal substrate superior in heat conductivity and a low thermal diffusion layer sputtered over the substrate. Carrying out FEM analysis of a 1200dpi-head of the above structure, we came to the conclusion that high resolution up of to 1200dpi was technically achievable. We also confirmed the possibility through print test.
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Document Type: Research Article

Publication date: 2001-01-01

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  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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