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Measurement of Modulus Changes of a Phenolic Adhesive Using Nanoindentation for an Inkjet Printhead Nozzle Plate

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Polyimide nozzle plates are bonded to inkjet printhead heater chips using a phenolic/polyvinylbutyral adhesive. A 25μm thick polyimide film is coated with a 12.5μm thick layer of a B-staged phenolic adhesive, which is cured after the nozzle plate is attached to the chip. B-staged phenolic materials undergo aging reactions at shipping and storage temperatures prior to being cured. This behavior makes it difficult to achieve consistent nozzle plate to chip adhesion. Understanding and quantifying the aging of the phenolic is necessary for predicting its adhesion performance before it is used in printhead production. In this study nanoindentation measurements of thermally aged phenolic adhesive samples were made in order to calculate the modulus of the material. Modulus measurements, XPS data, and nozzle plate adhesion results were then used as a basis for proposing a mechanism describing phenolic aging.
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Document Type: Research Article

Publication date: 2001-01-01

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  • For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.

    Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.

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