Measurement of Modulus Changes of a Phenolic Adhesive Using Nanoindentation for an Inkjet Printhead Nozzle Plate

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Polyimide nozzle plates are bonded to inkjet printhead heater chips using a phenolic/polyvinylbutyral adhesive. A 25μm thick polyimide film is coated with a 12.5μm thick layer of a B-staged phenolic adhesive, which is cured after the nozzle plate is attached to the chip. B-staged phenolic materials undergo aging reactions at shipping and storage temperatures prior to being cured. This behavior makes it difficult to achieve consistent nozzle plate to chip adhesion. Understanding and quantifying the aging of the phenolic is necessary for predicting its adhesion performance before it is used in printhead production. In this study nanoindentation measurements of thermally aged phenolic adhesive samples were made in order to calculate the modulus of the material. Modulus measurements, XPS data, and nozzle plate adhesion results were then used as a basis for proposing a mechanism describing phenolic aging.

Document Type: Research Article

Publication date: January 1, 2001

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  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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