Curable Inks for Laser Thermal Transfer Printing
Abstract:The semiconductor industry has two major printing technologies: pad printing and direct laser marking. Pad printing offers highly legible marks; however, this technology is not digital and solvent-based inks are required. Direct laser etching offers digital capability with poor contrast. Our laser thermal transfer printing technology offers high contrast marks with digital capability on a variety of semiconductor materials including epoxy molding compounds, ceramic, gold, nickel and silicon.
Our laser thermal transfer printing process employs a proprietary foil ink which is transferred to an electronic component. The mark is subsequently cured with ultraviolet light or thermal energy to obtain highly durable marks. The prints on these semiconductor parts must be resistant to solvent, acid (solder flux) and abrasion.
I will present the requirements for the electronics industry and the chemical approaches that have been taken with various laser printing heads.
Document Type: Research Article
Publication date: January 1, 2000
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.
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