The semiconductor industry requires high definition, highly legible markings on semiconductor parts which may be made of various materials. The prints must withstand solvents, solder flux, heat, and abrasion without becoming illegible. Gravure printing, the traditional approach, requires
wet inks and printing plates and does not offer the flexibility of digital printing. Laser marking is increasingly used and offers digital printing advantages, but legibility of direct laser prints is poor because of lack of satisfactory contrast mechanisms. We have developed and sold a
novel laser thermal transfer marking system for this application which allows dry, high contrast, durable, 500 dot/inch digital prints to be made on silicon, nickel, gold, ceramic and epoxy surfaces. The images are cured with UV or thermal energy. This process required the design of a novel
laser printing head which is capable of applying proprietary thermal transfer foil onto small parts while exerting a minimum of force on the parts. We will present the requirements for the application, some of the technical approaches that were tried for design of the marking engine, and
describe the solutions selected.
Document Type: Research Article
Publication date: January 1, 2000
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For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.