Charging Behavior of Toner Layer in Contact-type Non-magnetic Single Component Developing Process
Abstract:Properties of a toner layer, especially toner charge of the toner layer formed onto a developing roller in developing unit influences significantly the developing performance in an electrophotographic developing process. In contact-type non-magnetic single component developing process, the properties of the toner layer change in the developing step due to contact the toner layer with surface of a photoreceptor under the developing electrical field.
The toner layer formed onto the developing roller was transferred to a metal plate connected to a bias voltage supply by contact developing method. Controlling the bias voltage applied to the metal plate changed developing electrical field formed on between the developing roller and the metal plate. Charging behavior of the toner layer in this process were studied by measuring the properties of the toner layer before and after the developing step.
Amount of toner charge of the toner layer formed onto the developing roller was divided equally by in this developing step. It was clarified that the amount of toner charge changed by charge injection, which depend on the developing electrical field in the contact developing step. In the toner layer consisting of the lower electrical resistivity toner, amount of the toner charge decreased even when the developing electrical field was zero.
Document Type: Research Article
Publication date: 1999-01-01
For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.
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