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New Thermal Dye Transfer Recording Method by Using an Intermediate Transfer Recording Medium

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Current thermal dye sublimation transfer methods required on exclusive receiving layer for printing a dye image. We propose a new thermal transfer recording media(INTM).

The principle of this new process is that the dye image is formed on the receiving layer providing peeling capability on the medium. The dye image is transferred onto the applied object together with the receiving layer. This medium can be applied to various objects without an excellent receiving paper.

The INTM sheets is composed of a protective layer and a receiving layer formed on one surface of the base sheet. These layers can be peeled off from the base sheet. The dye image using an INTM sheet has good durability since the dye image is formed inside the layer under the protective layer. We have also developed a heat-seal layer to enable to various applications. After the heat-seal layer is printed on the dye image in INTM by a thermal head, the dye image in the receiving layer is transferred onto the object together with the heat-seal layer.

The applications include card material (PVC, PET. PC, ABS) and natural paper etc. INTM can be used for card printers, passport printers, seal printers and digital photo printers.

Document Type: Research Article

Publication date: 1998-01-01

More about this publication?
  • For more than 25 years, NIP has been the leading forum for discussion of advances and new directions in non-impact and digital printing technologies. A comprehensive, industry-wide conference, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems, including drop-on-demand ink jet, wide format ink jet, desktop and continuous ink jet, toner-based electrophotographic printers, production digital printing systems, and thermal printing systems, as well as the engineering capability, optimization, and science involved in these fields.

    Since 2005, NIP has been held in conjunction with the Digital Fabrication Conference.

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