The Effect of Various Sputtering Parameters on Ta Phase Formation Using an I-Optimal Experimental Design
Abstract:Five process factors are varied to find conditions necessary for α and β phase formation in tantalum thin films deposited on SiC. These are: sputtering time, input power, pre-sputter etch time, preheat time at 250 C and sputtering temperature. An empirical model is developed which predicts the maximum or minimum amount of β phase possible over a large range of film thickness (∼25 to ∼2,000 nm). The maximum predicted (average) % β phase at the maximum sputtering temperature is only 8%, with 95% confidence bounds of [5%, 12%]. The other factors place a much lower restriction on β phase formation. Pure α phase is easily produced over a wide range of operating conditions. Only a weak relationship is found between film thickness and phase composition. The Ta film resistivity increases with the amount of b phase, in agreement with the literature.
Document Type: Research Article
Publication date: 1998-01-01
For more than 30 years, IS&T's series of digital printing conferences have been the leading forum for discussion of advances and new directions in 2D and 3D printing technologies. A comprehensive, industry-wide conference that brings together industry and academia, this meeting includes all aspects of the hardware, materials, software, images, and applications associated with digital printing systems?particularly those involved with additive manufacturing and fabrication?including bio-printing, printed electronics, page-wide, drop-on-demand, desktop and continuous ink jet, toner-based systems, and production digital printing, as well as the engineering capability, optimization, and science involved in these fields. In 2016, the conference changed its name formally to Printing for Fabrication to better reflect the content of the meeting and the evolving technology of printing.
Please note: For purposes of its Digital Library content, IS&T defines Open Access as papers that will be downloadable in their entirety for free in perpetuity. Copyright restrictions on papers vary; see individual paper for details.
- Information for Authors
- Submit a Paper
- Subscribe to this Title
- Membership Information
- Terms & Conditions
- Ingenta Connect is not responsible for the content or availability of external websites