Publisher: IOP Publishing

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Volume 11, Number 3A, 2002

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Industrial innovation based on fundamental physics*
pp. A1-A6(6)
Author: Kogelschatz, U.

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Plasma expansion: fundamentals and applications
pp. A100-A104(5)
Authors: Engeln, R.; Mazouffre, S.; Vankan, P.; Bakker, I.; Schram, D.C.

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Helicon sources with m 1 and m 2 helical antenna coupling*
pp. A120-A130(11)
Authors: Krämer, M.; Lorenz, B.; Clarenbach, B.

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Energy loss of MeV/n heavy ions in dense hydrogen plasmas
pp. A131-A137(7)
Authors: Maynard, G.; Deutsch, C.; Gardès, D.; Chabot, M.

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Spatial distribution of turbulence in the Wendelstein 7-AS stellarator
pp. A138-A142(5)
Authors: Basse, N.P.; Michelsen, P.K.; Zoletnik, S.; Saffman, M.; Endler, M.; Hirsch, M.

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Laser Thomson scattering studies of glow discharge plasmas
pp. A143-A149(7)
Authors: Muraoka, K.; Uchino, K.; Yamagata, Y.; Noguchi, Y.; Mansour, M.; Suanpoot, P.; Narishige, S.; Noguchi, M.

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Reactive molecular plasmas
pp. A150-A153(4)
Authors: Ricard, A.; Monna, V.

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Some plasma environmental technologies developed in Russia
pp. A159-A165(7)
Author: Rutberg, P.G.

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Investigations of ion emission from plasma produced by high-power 1-ps laser pulse
pp. A173-A177(5)
Authors: Wolowski, J.; Badziak, J.; Krása, J.; Láska, L.; Parys, P.; Rohlena, K.; Woryna, E.

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Production and control of planar microwave plasmas for materials processing
pp. A178-A190(13)
Authors: Ganachev, I.P.; Sugai, H.

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Mechanism of highly selective SiO2 contact hole etching
pp. A202-A205(4)
Authors: Matsui, M.; Tatsumi, T.; Sekine, M.

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Glow discharge processing in the liquid crystal display industry
pp. A206-A210(5)
Authors: Schmitt, J.; Elyaakoubi, M.; Sansonnens, L.

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Industrial developments of scientific insights in dusty plasmas
pp. A211-A218(8)
Authors: Boufendi, L.; Bouchoule, A.

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Progress in the study of dusty plasmas
pp. A219-A228(10)
Author: Mendis, D.A.

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Nucleation and subsequent growth of clusters in reactive plasmas
pp. A229-A233(5)
Authors: Watanabe, Y.; Shiratani, M.; Koga, K.

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Optical plasma emission spectroscopy of etching plasmas used in Si-based semiconductor processing
pp. A26-A30(5)
Authors: Donnelly, V.M.; Malyshev, M.V.; Schabel, M.; Kornblit, A.; Tai, W.; Herman, I.P.; Fuller, N.C.M.

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Electronegative plasmas - why are they so different?
pp. A31-A37(7)
Author: Franklin, R.N.

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Theory and modelling of arc cathodes
pp. A49-A54(6)
Author: Benilov, M.S.

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Capillary discharge sources of hard UV radiation
pp. A64-A68(5)
Authors: Cachoncinlle, C.; Dussart, R.; Robert, E.; Götze, S.; Pons, J.; Mohanty, S.R.; Viladrosa, R.; Fleurier, C.; Pouvesle, J.M.

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Resonant phenomena of hydromagnetic waves in non-uniform space plasmas
pp. A69-A73(5)
Authors: Cadez, V.M.; Keyser, J.D.; Roth, M.

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Low-pressure plasma sources for etching and deposition
pp. A74-A79(6)
Authors: Cooke, M.J.; Hassall, G.

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Line shape study of neutral argon lines in plasma of an atmospheric pressure wall stabilized argon arc
pp. A95-A99(5)
Authors: Djurovic, S.; Nikolic, D.; Mijatovic, Z.; Kobilarov, R.; Konjevic, N.

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