Journal of Micromechanics and Microengineering

Design, fabrication and testing of a micromachined thermo-optical light modulator based on a vanadium dioxide array
pp. 833-840(8)
Authors: Jiang L.; Carr W.N.

Design and modeling of a MEMS bidirectional vertical thermal actuator
pp. 841-850(10)
Authors: Yan D.; Khajepour A.; Mansour R.

Simulation of the Bosch process with a string–cell hybrid method
pp. 851-858(8)
Authors: Zhou R.; Zhang H.; Hao Y.; Wang Y.

A silicon microspeaker for hearing instruments
pp. 859-866(8)
Authors: Cheng M-C.; Huang W-S.; Huang S.R-S.

Fine line-width black matrix of a color filter by an advanced polishing method
pp. 867-875(9)
Authors: Yen T-C.; Tso P-L.

The clogging pressure of bubbles in hydrophilic microchannel contractions
pp. 876-883(8)
Authors: Mads Jakob Jensen; Goranovic G.; Bruus H.

Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold
pp. 884-890(7)
Authors: Taklo M.M.V.; Storås P.; Schjølberg-Henriksen K.; Hasting H.K.; Jakobsen H.

Colored particle tracking method for mixing analysis of chaotic micromixers
pp. 891-899(9)
Authors: Tae Gon Kang; Tai Hun Kwon

A reduced-order model for electrically actuated microplates
pp. 900-906(7)
Authors: Zhao X.; Abdel-Rahman E.M.; Nayfeh A.H.

Mold-type SiC field emitters with heavily boron-doped gates
pp. 907-913(7)
Authors: Górecka-Drzazga A.; Dziuban J.; Drzazga W.

Analytical heat-transfer modeling of multilayered microdevices
pp. 914-926(13)
Author: Hao Q.

Surface roughness measurements of micromachined polycrystalline silicon films
pp. 927-931(5)
Authors: Phinney L.M.; Lin G.; Wellman J.; Garcia A.

Fabrication of an SU-8 based microfluidic reactor on a PEEK substrate sealed by a 'flexible semi-solid transfer'(FST) process
pp. 932-940(9)
Authors: Song Y.; Kumar C.S.S.R.; Hormes J.

Development of the one-step DRIE dry process for unconstrained fabrication of released MEMS devices
pp. 941-944(4)
Authors: Docker P.T.; Kinnell P.K.; Ward M.C.L.

Fabrication of optical waveguides in thermosetting polymers using hot embossing
pp. 945-949(5)
Author: Choi C-G.

CO₂ laser annealing of sputtering deposited NiTi shape memory thin films
pp. 950-956(7)
Authors: He Q.; Hong M.H.; Huang W.M.; Chong T.C.; Fu Y.Q.; Du H.J.

Design and testing of conductive polysilicon beam leads for use in a high-density biomedical connector
pp. 957-968(12)
Authors: Nikles S.; Bradley R.; Bledsoe S.; Najafi K.

A polymeric microgripper with integrated thermal actuators
pp. 969-974(6)
Authors: Nguyen N-T.; Ho S-S.; Low C.L-N.

Application of 3D glycerol-compensated inclined-exposure technology to an integrated optical pick-up head
pp. 975-983(9)
Authors: Hung K-Y.; Hu H-T.; Tseng F-G.

On minimum exit-burr in micro cutting
pp. 984-988(5)
Authors: Fang F.Z.; Liu Y.C.

Theoretical analysis of the effect of static charges in silicon-based dielectric thin films on micro- to nanoscale electrostatic actuation
pp. 989-998(10)
Authors: Wu Y.; Shannon M.A.

Fundamental limitations of LIGA x-ray lithography: sidewall offset, slope and minimum feature size
pp. 999-1011(13)
Author: Griffiths S.K.

Inductive generation of arbitrary waveforms for electrical stimulation using implantable microcoils
pp. 1012-1021(10)
Authors: Wu J.; Dubhashi S.; Bernstein G.H.

Morphology of macro-pores formed by electrochemical etching of p-type Si
pp. 1022-1028(7)
Authors: Astrova E.V.; Borovinskaya T.N.; Tkachenko A.V.; Balakrishnan S.; Perova T.S.; Rafferty A.; Gun'ko Y.K.

Through-wafer interconnect technology for silicon
pp. 1029-1036(8)
Authors: Kutchoukov V.G.; Shikida M.; Mollinger J.R.; Bossche A.

A laser induced cavitation pump
pp. 1037-1046(10)
Authors: Wang G.R.; Santiago J.G.; Mungal M.G.; Young B.; Papademetriou S.

Novel three-dimensional embedded SU-8 microchannels fabricated using a low temperature full wafer adhesive bonding
pp. 1047-1056(10)
Authors: Blanco F.J.; Agirregabiria M.; Garcia J.; Berganzo J.; Tijero M.; Arroyo M.T.; Ruano J.M.; Aramburu I.; Mayora K.

Micro- and nanoscale non-ideal gas Poiseuille flows in a consistent Boltzmann algorithm model
pp. 1057-1063(7)
Authors: Wang M.; Li Z.

Simulation studies on nonlinear dynamics and chaos in a MEMS cantilever control system
pp. 1064-1073(10)
Authors: Liu S.; Davidson A.; Lin Q.

Evolutionary algorithms for compact thermal modelling of microsystems: application to a micro-pyrotechnic actuator
pp. 1074-1082(9)
Authors: Palacin J.; Salleras M.; Puig M.; Samitier J.; Marco S.

Influence of liquid surface tension on stiction of SOI MEMS
pp. 1083-1090(8)
Authors: Raccurt O.; Tardif F.; d'Avitaya F.A.; Vareine T.

Numerical method for predicting three-dimensional steady compressible flow in long microchannels
pp. 1091-1100(10)
Author: Chen C-S.

The design of metal strain gauges on diaphragms
pp. 1101-1108(8)
Authors: Schomburg W.K.; Rummler Z.; Shao P.; Wulff K.; Xie L.

Compact models for squeezed-film dampers with inertial and rarefied gas effects
pp. 1109-1118(10)
Author: Veijola T.