Journal of Micromechanics and Microengineering

Preface
pp. end-range(1)
Author: Hill M.

Bulk silicon micromachining for MEMS in optical communication systems
pp. 349-360(12)
Authors: Hoffmann M.; Voges E.

Protection of MOS capacitors during anodic bonding
pp. 361-367(7)
Authors: Schjølberg-Henriksen K.; Plaza J.A.; Rafí J.M.; Esteve J.; Campabadal F.; Santander J.; Jensen G.U.; Hanneborg A.

SU-8 thick photoresist processing as a functional material for MEMS applications
pp. 368-374(7)
Authors: Conradie E.H.; Moore D.F.

Low-cost thermoforming of micro fluidic analysis chips
pp. 375-379(5)
Authors: Truckenmüller R.; Rummler Z.; Schaller T.; Schomburg W.K.

Polyimide sacrificial layer and novel materials for post-processing surface micromachining
pp. 385-389(5)
Authors: Bagolini A.; Pakula L.; Scholtes T.L.M.; Pham H.T.M.; French P.J.; Sarro P.M.

Temperature influence on etching deep holes with SF₆/O₂ cryogenic plasma
pp. 390-394(5)
Authors: Craciun G.; Blauw M.A.; Drift E.v.d.; Sarro P.M.; French P.J.

Through-wafer copper electroplating for three-dimensional interconnects
pp. 395-399(5)
Authors: Nguyen N.T.; Boellaard E.; Pham N.P.; Kutchoukov V.G.; Craciun G.; Sarro P.M.

Electrodeposited Co-Ni alloys for MEMS
pp. 400-405(6)
Authors: Duch M.; Esteve J.; Gómez E.; Pérez-Castillejos R.; Vallés E.

A new transferred ultra-thin silicon micropackaging
pp. 406-409(4)
Authors: Chen J-Y.; Huang L-S.; Chu C-H.; Peizen C.

Time constant and lateral resonances of thermal vertical bimorph actuators
pp. 410-413(4)
Authors: Sehr H.; Tomlin I.S.; Huang B.; Beeby S.P.; Evans A.G.R.; Brunnschweiler A.; Ensell G.J.; Schabmueller C.G.J.; Niblock T.E.G.

A 32-site neural recording probe fabricated by DRIE of SOI substrates
pp. 414-419(6)
Authors: Norlin P.; Kindlundh M.; Mouroux A.; Yoshida K.; Hofmann U.G.

Self-aligning gas/liquid micropump
pp. 420-424(5)
Authors: Schabmueller C.G.J.; Koch M.; Mokhtari M.E.; Evans A.G.R.; Brunnschweiler A.; Sehr H.

Materials and processing for realization of micro-hotplates operated at elevated temperature
pp. 425-429(5)
Authors: Fürjes P.; Vízváry Z.; Ádám M.; Bársony I.; Morrissey A.; Dücso C.

Development of tools for handling and assembling microcomponents
pp. 430-437(8)
Authors: Ansel Y.; Schmitz F.; Kunz S.; Gruber H.P.; Popovic G.

Titanium as a micromechanical material
pp. 438-443(6)
Authors: O'Mahony C.; Hill M.; Hughes P.J.; Lane W.A.

Thick photoresist development for the fabrication of high aspect ratio magnetic coils
pp. 444-449(6)
Authors: Brunet M.; O'Donnell T.; O'Brien J.; McCloskey P.; Mathuna S.C.Ó.

Influence of Ge implantation on the mechanical properties of polycrystalline silicon microstructures
pp. 450-457(8)
Authors: Polymenakos S.; Stergiou V.C.; Kontos A.G.; Tsamis C.; Raptis Y.S.; Tsoukalas D.

Pull-in voltage analysis of electrostatically actuated beam structures with fixed-fixed and fixed-free end conditions
pp. 458-464(7)
Authors: Pamidighantam S.; Puers R.; Baert K.; Tilmans H.A.C.

Three-dimensional miniaturized power inductors realized in a batch-type hybrid technology
pp. 470-474(5)
Authors: Saidani M.; Gijs M.A.M.

Postbuckled micromachined square membranes under differential pressure
pp. 475-478(4)
Authors: Kramer T.; Paul O.

Condition monitoring with axle box bearings using resonant microelectromechanical sensors
pp. 479-485(7)
Author: Peiner E.

Development of a microfluidic device for fluorescence activated cell sorting
pp. 486-494(9)
Authors: Krüger J.; Singh K.; O'Neill A.; Jackson C.; Morrison A.; O'Brien P.

Modelling of an accelerometer based on a levitated proof mass
pp. 495-503(9)
Authors: Houlihan R.; Kraft M.