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Volume 11, Number 2, 2001

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Ultra-fine machining tool/molds by LIGA technology
pp. 94-99(6)
Authors: Yang H.; Pan C-T.; Chou M-C.

Low-temperature full wafer adhesive bonding
pp. 100-107(8)
Authors: Niklaus F.; Enoksson P.; Klvesten E.; Stemme G.

Analysis and testing of a fluidic vortex microdiode
pp. 108-112(5)
Authors: Anduze M.; Colin S.; Caen R.; Camon H.; Conedera V.; Conto T.D.

An axial flux electromagnetic micromotor
pp. 113-117(5)
Authors: Yang C.; Zhao X.; Ding G.; Zhang C.; Cai B.

A wide-range micromachined threshold accelerometer array and interface circuit
pp. 118-125(8)
Authors: Selvakumar A.; Yazdi N.; Najafi K.

Mixing characteristics of T-type microfluidic mixers
pp. 126-132(7)
Authors: Gobby D.; Angeli P.; Gavriilidis A.

Patterning, electroplating and removal of SU-8 moulds by excimer laser micromachining
pp. 133-139(7)
Authors: Ghantasala M.K.; Hayes J.P.; Harvey E.C.; Sood D.K.

On the out-of-plane deformation of V-shaped micromachined beams
pp. 153-160(8)
Authors: Tsou C.; Yin H.; Fang W.

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