In-process force monitoring for precision grinding semiconductor silicon wafers

Authors: Couey, Jeremiah A.¹; Marsh, Eric R.¹; Knapp, Byron R.²; Vallance, R. Ryan³

Source: International Journal of Manufacturing Technology and Management, Volume 7, Numbers 5-6, 2 September 2005 , pp. 430-440(11)

Publisher: Inderscience Publishers

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Abstract:

Forces generated during precision wafer grinding are small and present challenges for accurate and reliable process monitoring. In this work, these challenges are met by incorporating noncontact displacement sensors into an aerostatic spindle that is calibrated to measure grinding forces from the relative motion between the spindle rotor and stator. This arrangement allows the calculation of grinding forces without introducing compliance into the structural loop of the grinding machine. Aerostatic spindles are used in precision wafer grinding requiring high stiffness and very low error motions (5 25 nm). Several experiments evaluate this force sensing approach in detecting workpiece contact, process monitoring with small depths of cut, and detecting workpiece defects. The results indicate that force measurements offer good performance for monitoring precision wafer grinding since this approach provides excellent contact sensitivity, high signal resolution, and has sufficient bandwidth to detect events occurring within a single revolution of the grinding wheel.

Keywords: COMPUTING JOURNALS; Computing Science, Applications and Software; Internet and Web Services; TECHNICAL JOURNALS; Materials and Manufacturing; MANAGEMENT JOURNALS; Operational Management, Marketing and Services; Policy and Organisational Management

Document Type: Research article

DOI: http://dx.doi.org/10.1504/IJMTM.2005.007695

Affiliations: 1: Machine Dynamics Research Laboratory, The Pennsylvania State University, 21 Reber Building, University Park, 16802 PA, USA. 2: Olympic Laser, Inc., 410 Ida Street West, Bremerton, WA 98312, USA. 3: Precision Systems Laboratory, The George Washington University, 738 Phillips Hall, 801 22nd St. NW, Washington DC, 20052, USA

Publication date: 2005-09-02

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International Journal of Manufacturing Technology and Management publishes original, empirical and review papers; case studies; conference reports; technology reports and new; book reviews and notes; commentaries. In addition to the regular issues of the journal, International Journal of Manufacturing Technology and Management
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In-process force monitoring for precision grinding semiconductor silicon wafers

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