Authors: Serizawa, H.¹; Ando, M.²; Lewinsohn, C.A.³; Murakawa, H.⁴

Source: International Journal of Materials and Product Technology, Volume 16, Numbers 1-2, 1 October 2004 , pp. 213-222(10)

Publisher: Inderscience Publishers

Abstract:

Creep deformation in SiC/SiC composites was analysed using a new computer simulation method with time dependent interface elements. The simulation method was used to describe the crack growth in SiC/SiC composite under four-point bending of single-edge-notched beam bend-bars. Two methods were used to simulate the crack growth due to fibre creep. In one method, the creep property was introduced into the interface elements by the general method of FEM analysis. In the second method, a new technique making the best use of the potential function was used. The stage-II steady state creep deformation was simulated by both methods, and the stage-III crack growth and the transition from stage-II to stage-III could be simulated by only the new method. Additionally, the stage-I was simulated by the new method. The new method has the potential to completely simulate creep deformation in SiC/SiC composite due to fibre creep.

Keywords: TECHNICAL JOURNALS; Design and Product Development; Materials and Manufacturing

Document Type: Research article

DOI: http://dx.doi.org/10.1504/IJMPT.2001.005422

Affiliations: 1: Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan. 2: Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan. 3: Pacific Northwest National Laboratory, MSIN:P8-15, P.O.Box 999, Richiand, WA 99352, USA. 4: Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan

Publication date: 2004-10-01

More about this publication?

• The International Journal of Materials and Product Technology is a refereed and authoritative publication which provides a forum for the exchange of information and ideas between materials academics and engineers working in university research departments and research institutes, and manufacturing, marketing and process managers, designers, technologists and research and development engineers working in industry..
• Information for Authors
• Submit a Paper
• Subscribe to this Title
• Terms & Conditions
• Newsletter
• Blog
• ingentaconnect is not responsible for the content or availability of external websites

Related content

• In this: publication
• By this: publisher
• In this Subject: Technology
• By this author: Serizawa, H. ;  Ando, M. ;  Lewinsohn, C.A. ;  Murakawa, H.

Website © Publishing Technology. Article copyright remains with the publisher, society or author(s) as specified within the article.

• Terms and conditions
• Privacy policy
• Information for advertisers