Model and solution to the product disassembly sequence planning
Source: International Journal of Environmental Technology and Management, Volume 14, Numbers 5-6, November 2011 , pp. 501-515(15)
Publisher: Inderscience Publishers
Abstract:Disassembly has been one of the most important content in the product life cycle design. The old Disassembly Sequence Planning (DSP) model takes parts as objective, and does not consider incomplete disassembly, and interacting of different connection relationships of one part. Connection relationship between parts is the objective in this paper, and four constraints during the connection relationship removing process are given. This new model is based on Simulated Annealing Algorithm (SAA). In the case study, a simplified computer mainframe is analysed. The comparison results of two different DSP model show that new model is more effective and accurate.
Document Type: Research article
Affiliations: 1: School of Mechanical and Automotive Engineering, Hefei University of Technology, Hefei, Anhui 230009, China. 2: Department of Industrial Engineering, Texas Tech University, Lubbock, Texas 79409, USA
Publication date: 2011-11-01
- The objectives of the International Journal of Environmental Technology and Management are to establish an effective channel of communication between policy-makers, government agencies, academics and research institutions, and professionals working in the field, and to provide a forum for them to disseminate information and to learn from each other's work. The international dimension is emphasised in order to overcome cultural and national barriers and to meet the needs of accelerating technological change and changes in the global economy.
- Information for Authors
- Submit a Paper
- Subscribe to this Title
- Terms & Conditions
- ingentaconnect is not responsible for the content or availability of external websites