International Journal of Computational Materials Science and Surface Engineerin logo Inderscience Publishers logo

The objective of the International Journal of Computational Materials Science and Surface Engineering is to establish an effective channel of communication between academic and research institutions and persons concerned with industrial research supported by practical application. It also aims at promoting and coordinating developments in the field of computational materials science and computational surface engineering by publishing original scientific papers which describe computer-aided methods of modelling, simulation and prediction for designing new engineering materials and the technological processes of the manufacturing in materials that are used for solving problems posed by materials and surface engineering professionsals, industrial managers and administrators, and technical education personnel.

Publisher: Inderscience Publishers

More about this publication?
Related content
Volume 2, Numbers 3-4, 28 July 2009

< previous issue | all issues | next issue >

Recent developments in experimental on-chip stiction research: a review
pp. 186-207(22)
Author: Spengen, W. Merlijn Van

Thin film shape memory alloys and microactuators
pp. 208-226(19)
Authors: Fu, Y.Q.; Luo, J.K.; Flewitt, A.J.; Huang, W.M.; Zhang, S.; Du, H.J.; Milne, W.I.

A review of silicon carbide development in MEMS applications
pp. 227-242(16)
Authors: Jiang, Liudi; Cheung, Rebecca

Advancement of micro&#47;nanotechnology research in Institute of Precision Engineering of Xi'an Jiaotong University
pp. 243-267(25)
Authors: Jiang, Zhuang-De; Jing, Wei-Xuan; Zhao, Yu-Long; Wang, Hai-Rong; Lu, De-Jiang

Low stress nanoporous SiN<SUB align=right>x membrane for cell culture
pp. 268-281(14)
Authors: Wei, Jia-Shen; Leck, Kwong Joo; Gaughwin, Philip; Avram, Marioara; Iliescu, Ciprian

Design and fabrication of a microgripper with a topology optimal compliant mechanism
pp. 282-301(20)
Authors: Huang, Shyh-Chour; Chiu, Chien-Ching; Chen, Wei-Liang

Modelling and simulations of DRIE including a footing effect
pp. 302-311(10)
Authors: Zhang, Jian; Huang, Qing-An; Li, Wei-Hua

Process development support environment: a tool suite to engineer manufacturing sequences
pp. 312-334(23)
Authors: Ortloff, Dirk; Popp, Jens; Schmidt, Thilo; Bruck, Rainer

Indentation on very smooth silicon wafers
pp. 335-341(7)
Authors: Huang, W.M.; Fan, H.; Leng, S.C.

Nanomechanical characterisation of MEMS thin film materials
pp. 342-354(13)
Authors: He, J.H.; Luo, J.K.; Hopcroft, M.A.; Le, H.R.; Moore, D.F.

< previous issue | all issues | next issue >

Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content

Text size:

A | A | A | A
Share this item with others: These icons link to social bookmarking sites where readers can share and discover new web pages. print icon Print this page