Home >> International Journal of Computational Materials Science and Surface Engineerin, Volume 2, Numbers 3-4

Indentation on very smooth silicon wafers

Authors: Huang, W.M.1; Fan, H.1; Leng, S.C.2

Source: International Journal of Computational Materials Science and Surface Engineerin, Volume 2, Numbers 3-4, 28 July 2009 , pp. 335-341(7)

Publisher: Inderscience Publishers

Buy & download fulltext article:

OR

Price: $45.55 plus tax (Refund Policy)

Abstract:

At present, indentation is considered as the most convenient approach for characterising materials for MEMS and even NEMS devices. Here, we demonstrate that a very slight change in the average surface roughness (R<SUB align=right>a) of a commercial silicon wafer, that is, from 1.6 to 4.4 nm, can dramatically alter the indentation result. Another surface condition, namely, wetting, is also influential. Since it is not easy to quantitatively describe the effects of the interface between the indenter and tested material, the results of indentation test, as an approach for revealing the properties of a material, should be treated with great cautions.

Keywords: COMPUTING AND MATHEMATICS JOURNALS; Computing Science, Applications and Software; TECHNICAL JOURNALS; Electronic Systems, Control and Artificial Intelli; Materials and Manufacturing; Nanoscience and Nanotechnology; Simulation and Modelling

Document Type: Research article

DOI: http://dx.doi.org/10.1504/IJCMSSE.2009.027490

Affiliations: 1: School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Republic of Singapore 639798. 2: School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Republic of Singapore 639798

Publication date: 2009-07-28

More about this publication?
  • The objective of the International Journal of Computational Materials Science and Surface Engineering is to establish an effective channel of communication between academic and research institutions and persons concerned with industrial research supported by practical application. It also aims at promoting and coordinating developments in the field of computational materials science and computational surface engineering by publishing original scientific papers which describe computer-aided methods of modelling, simulation and prediction for designing new engineering materials and the technological processes of the manufacturing in materials that are used for solving problems posed by materials and surface engineering professionsals, industrial managers and administrators, and technical education personnel.
  • Information for Authors
  • Submit a Paper
  • Subscribe to this Title
  • Terms & Conditions
  • Newsletter
  • Blog
  • ingentaconnect is not responsible for the content or availability of external websites
Related content
Marked list

Tools

Key

Free Content
Free content
New Content
New content
Open Access Content
Open access content
Subscribed Content
Subscribed content
Free Trial Content
Free trial content

Text size:

A | A | A | A
^ Back to top
Share this item with others: These icons link to social bookmarking sites where readers can share and discover new web pages. print icon Print this page