A precise inspection technique for wafer pre‐sawing lines using Affine transformation
Source: International Journal of Computer Applications in Technology, Volume 39, Numbers 1-3, 18 August 2010 , pp. 46-52(7)
Publisher: Inderscience Publishers
Abstract:This study proposes a simple and fast technique for detecting wafer cutting lines using the Affine transformation before sawing. This technique was developed for the purpose of wafer alignment when alignment marks are unavailable. The edges of the pre‐sawing lines are complex and there are bright shapes in the sawing lines, so it is difficult to apply the conventional edge finding method. The sawing lines are represented by rectangular windows which are deformed by an Affine transformation. The amount of deformation is determined when the grey level in the window is a global minimum in the image. The global minimum is found by the golden section search. The algorithm was tested using 13 sample images and repeated ten times for each image. The results showed that the processing time was below 1200 ms and the deviation was in the sub‐pixel level. We found that the proposed method can be applied to align wafers in the dicing process.
Document Type: Research Article
Affiliations: 1: Mechatronics Team, Korea Institute of Industrial Technology, Cheonan, Chungnam, South Korea. 2: AM Technology, Ansan, Kyunggi, South Korea. 3: Department of Machine Design, Siheung, Kyunggi, South Korea
Publication date: 18 August 2010
- The International Journal of Computer Applications in Technology addresses issues of computer applications, information and communication systems, software engineering and management, CAD/CAM/CAE, numerical analysis and simulations, finite element methods and analyses, robotics, computer applications in multimedia and new technologies, computer aided learning and training.