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Laser drilling of blind via holes in aramid and glass/epoxy composites for multi-layer printed wiring boards

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Keywords: A. Aramid fibre; A. Glass fibres; B. Strength; E. Machining; Printed wiring board

Document Type: Research Article

DOI: http://dx.doi.org/10.1016/S1359-835X(00)00152-4

Affiliations: aSchool of Engineering, The University of Shiga Prefecture Hassaka, Hikone, 522-8533, Shiga, Japan

Publication date: July 1, 2001

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