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Stress induced diffusion along adhesional contact interfaces

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Keywords: Adhesional contact; Bond-strength; Gold wire; Interface self-diffusion; Room temperature bonding; Stress relaxation; Surface energy; Transient behavior; Vacancy diffusion

Document Type: Research Article

DOI: http://dx.doi.org/10.1016/S1359-6454(03)00015-6

Affiliations: JWRI, Osaka University 11-1, Mihogaoka, Ibaraki, , , 567-0047, Osaka, Japan

Publication date: May 7, 2003

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