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Thermomechanical behavior of different texture components in Cu thin films

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Keywords: Copper; Stress distribution; Texture; Thin films; X-ray diffraction (XRD)

Document Type: Research Article

DOI: http://dx.doi.org/10.1016/S1359-6454(01)00127-6

Affiliations: Max-Planck-Institut fur Metallforschung and Institut fur Metallkunde der Universitat, Seestrasze 71, D-70174 , Stuttgart, Germany

Publication date: July 17, 2001

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