Microstructures and dislocation configurations in nanostructured Cu processed by repetitive corrugation and straightening

Authors: Huang, J.Y.; Zhu, Y.T.; Jiang, H.; Lowe, T.C.

Source: Acta Materialia, Volume 49, Number 9, 25 May 2001 , pp. 1497-1505(9)

Publisher: Elsevier

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Keywords: Copper; Microstructure; Repetitive corrugation straightening; Transmission electron microscopy (TEM)

Document Type: Research Article

DOI: http://dx.doi.org/10.1016/S1359-6454(01)00069-6

Affiliations: Materials Science and Technology Division, MS G 755, Los Alamos National Laboratory, 87545, Los Alamos, NM, USA

Publication date: May 25, 2001

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